Canteliver Probe Card
MPI Cantilever Probe Card is extensively applied on gold bump and pad wafer testing for Screen driver, logic, and memory system. MPI’s cantilever probes are definitely the corresponding answer towards the calls for of fine pitch, small pad sizing, large velocity, less cleansing, multi-DUT, substantial pin rely, and ultra-lower leakage prerequisites. With outstanding craftsmanship, innovative architecture and demonstrated methodologies depending on mechanical and electrical simulation/measurement outcomes, earning MPI the best cantilever provider throughout the world.
FCB Probe Card
The FCB Probe Card is easily the most mature technology of buckling beam probe card. It is actually aimed to obtain the semiconductor ship manufacture time-to-market (TTM) and cost of test (COT) demand. FCB is actually a tested Resolution for a number of semiconductor production checks from early engineering pilot-operates to high volume production (HVM). FCB is prepared for product necessitating higher sign integrity probing (SI) and/or electric power integrity probing (PI). Apps contain cutting-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and more. FCB assures the globe’s greatest overall Price tag-of-ownership (COO) for various DUT purposes.
EVS Probe Card
The EVS Probe Card is surely an improvement in excess of the conventional buckling beam probe card. Vital characteristics are greater present-day carrying capability (C.C.C.) and lower balanced contact pressure (BCF), as well as Over-all MEMS-like qualities. EVS can certainly meet the prerequisite of advanced wafer probing. Specific alignment and superb planarity Regulate will be the vital aspects contributing to secure Get in touch with resistance. With its ability and performance, EVS Probe Card is an excellent option for Superior probe playing cards.
Osprey probe card
The Osprey probe card is MPI’s Alternative to demand for ever finer pitch. It can be suitable for smaller sized Al pad, and is also perfect for very small pitch software with peripheral and complete array pattern. With exact alignment and improved planarity control, Osprey can achieve better efficiency by multi-DUT design. The forming wire (FW) kind needle developed with MPI’s individual micro fabrication system not only delivers higher-top quality functionality and also will allow easy needle replacement and shortens sustaining cycle time.
Kestrel Probe Card
The Kestrel Probe Card is equipped with MEMS wire (MW) needle that is designed for the demand of low force probing. Additionally, it comes with a chance to fulfill Kestrel Probe Card significant C.C.C. and significant pin counts software. The MEMS approach assures very constant needle traits, and the special composition style and design allows precise alignment and planarity Command.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/